Photoresists are light-sensitive materials used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface. Photoresists are either positive tone or negative tone and most pervasively used in the manufacture of integrated circuits and flat panel displays.
Materials for the integrated circuit industry can be used for a wide variety of lithographic processes covering a wide range of exposure tools and processes. Applications range from sub-micron geometries to thick film applications. All materials are spin coated and can be matched to a large variety of substrates.
Materials for the flat panel display industry can also be used for a wide variety of processes. Applications extend beyond the 5th generation spin coating, into advanced slit-coating processes. Materials are also available for roller coating and extrusion coating.
Optronics
- Good coating uniformity on large size glass substrates; reduced UROKO MURA.
- Materials designed for high throughput, high dark erosion, and wide process margin
- Good adhesion property on various metal films and ITO in both developing and etching processes
IC Materials
- Good coating uniformity up to 100 microns
- Materials designed for high speed, high throughput, and wide process margins
- Casting solvents compatible with industry standard EBR and pre-wet
Photoresist for Customary Processes | Detail |
|---|
| RFP series |
roll-coating positive-tone photoresist |
| TFP series |
spin-coating positive-tone photoresist (higher photospeed) |
| SZP series |
spin-coating positive-tone photoresist (lower photospeed) |
| HKT series |
spin- and slit&spin-coating positive-tone photoresist (lower photospeed) |
| SFP series |
slit&spin-coating positive-tone photoresist |
| SR series |
slit-coating positive-tone photoresist (higher photospeed), half-tone capable |
| SOP series |
slit-coating positive-tone photoresist (lower photospeed), half-tone capable |
Advanced Photoresist for Next-Generation Displays | Detail |
|---|
| SZF series |
high-resolution photoresists for advanced half-tone technology |
| SZC series |
advanced photoresists for Ti/Cu technology |
Specialized Photoresist |
Detail |
| AFP series |
photoresists for vertical aligning and other purposes |
| RG series |
i-line photoresists
|
| SC4 series |
high-thermal photoresist for 4-mask technology |
| CTP series |
negative-tone photoresists for OLED and other applications |
| ANR series |
negative-tone photoresists for PMOLED
|
| LP series |
positive-tone i-line photoresist for AMOLEDRoller coating - RFP series - Roll Coat Positive-tone Photoresist for Flat Panel Display |
IC Photoresists |
Detail |
| g/line/Broadband/xover |
formulations for g-Line/h-Line exposures, and formulations that are suitable for both broadband and i-Line exposure |
| 1500-series |
|
| 5200-series |
Novolak-based formulations also suited for image-reversal |
| 6000-series |
|
| 6600-series |
|
| 8100 |
|
| GXR-601 |
|
Other formulations available, consult your AZ Account Manager
I-Line |
Detail |
| MiR 700-series |
fast, cost-effective photoresists designed for replacement of 0.3 um and larger feature-size mid-range and crossover production products; these resists work well in both surfactant and non-surfactant containing tetramethylammonium hydroxide (TMAH) developers using standard conditions. |
Lift off Photoresists |
Detail |
| nLOF 2000-series |
TMAH-developable formulations for film thicknesses in range 2 - 7 um |
| nLOF 5510 |
TMAH-developable formulation for sub-0.5 um feature sizes |
Specialty negative-tone i-Line formulations, using standard lithography processes, suitable for metal-lift-off applications
Thick Film Photoresists (TFR) |
Detail |
| P4000-series |
workhorse TFR products, h-line/broadband capable positive-tone formulations, developed using inorganic developer systems
|
| 9000-series |
i-Line positive-tone TFR with higher aspect ratios than P4000
|
| TPM 606 |
positive-tone photoresist tuned for g-Line, i-line and aligner exposure tools, ideal for wet etch applications |
| 10XT |
positive-tone novolak formulation for film thicknesses in the range of 5 to 25 um, sensitive to g/h/i-Line wavelengths, developable in either TMAH-type or inorganic developers |
| 40XT |
chemically-amplified positive-tone TFR, processed using TMAH-type developers |
| nXT-series |
chemically-amplified negative-tone TFR for Cu RDL and TSV plating/etch applications |
Formulations suitable as metal plating masks, etch masks, large-feature lithography; film thickness from 1 um to 100um; specific formulations which work with inorganic as well as TMAH-type developers
Photoresists are used by the various industries to manufacture many types of devices, including:
- Flat Panel Displays
- OLED
- Color filter
- e-paper
- touch panel
- Flash memory
- Discrete and power
- DRAM
- CCD image sensors
- Microprocessors
- Hard disc drives
- LED
Advise on safety handling:
Refer to the current Material Safety Data Sheet (MSDS) and product label for detailed information prior to handling.
Storage conditions
- Keep container tightly closed and dry in a cool, well-ventilated place.
- Store at appropriate temperature. See label for details.
- Store in original container.
- Transport and store under dry conditions tightly closed and protected from heat and light.
Shelf life
Under recommended storage conditions, photoresists typically have at least three months shelf life, often six-months or more depending upon the formulation; contact your AZ Account Manager for more information
Package types
Recommended materials of construction include stainless steel, glass, ceramic, PTFE, polypropylene, and high density polyethylene.
1-, 4-, 5-, 10-, and 200-liter package sizes are available, based upon the product formulation; contact your AZ Account Manager for more information.